Clean Room Workers May be Exposed to Dangerous Solvents during the Semiconductor Chip Manufacturing Process.
An Estimated 50,000 individuals who worked in semiconductor fabrication rooms from 1986 through the mid-1990s are potentially at risk for a higher incidence of birth defects, cancer and other injuries from exposure to solvents.
The semiconductor industry uses many toxic chemicals to manufacture the components that make up a computer, including disk drives, circuit boards, video display equipment, and silicon chips themselves, the basic building blocks of computer devices. The toxic materials needed to make the 220 billion silicon chips manufactured annually are staggering in amount and include highly corrosive hydrochloric acid; metals such as arsenic, cadmium, and lead; volatile solvents such as methyl chloroform, toluene, benzene, acetone, and trichloroethylene; and toxic gases such as arsine. Many of these chemicals are known or probable human carcinogens.
Statistics published in April 1999 by the U.S. Department of Labor's Bureau of Labor Statistics revealed that semiconductor workers have a rate of occupational illnesses resulting in lost workdays that is twice as high as that of workers in other manufacturing sectors.
Manufacturing a computer chip involves a complex fabrication
process, creating a chip that consists of many layers with each
layer having a complex pattern. The step in the manufacturing
process that results in exposure to solvents is the creation
of the detailed pattern on the silicone layers. The detailed
patterns are created on the layers of silicon using a technique
called photolithography. Photolithography involves applying photoresist
over the silicon. The unexposed silicone is washed away using
solvents. Often the the solvent contains harmful substances such
as glycol ethers, and plant clean room workers involved in photolithography
may be harmed by inhalation and exposure.
Who is at Risk?
Anyone who worked in a clean room
or semiconductor plant location where solvents (primarily photoresist).
The longer the time spent in the clean room the greater the risk,
however short term exposure can be cause for concern were levels
of solvents were significantly greater.
Other workers at risk:
Spray Coaters.
Spin Coaters.
Individuals who worked with chemicals or solvents such as Photoresist.
Individuals who worked with metals such as arsenic or arsine.
Individuals who worked with toxic gases.
Individuals who worked in other capacities in semiconductor fabrication
but handled or used large quantities of solvents.
How Exposure Occurs?
Both Dermal exposure (contact with skin) and Inhalation
exposure have been linked to health problems and birth defects.
Dermal exposure occurs when there is direct solvent contact
with the skin; inadequate glove and clothing protection, i.e.
latex versus butyl or nitrile rubber gloves. Work involved immersion
of hands in solvents; or a history of spills or splashes in the
work area.
Inhalation exposure occurs when there is the presence of strong
odors while handling or using solvents; the work are had no local
or systematic exhaust; equipment such as a headway spinner was
not properly enclosed; The air monitoring data regarding the
level of solvents was above the Permissible Exposure Limits (PEL)
or above the non-detect.
Get Legal Help | Who is Exposed? | Frequently Asked Questions | Dangerous Chemicals | Birth Defects
Terms of Use and Legal Notices
Return to Home Page